IEEE Spectrum breed · Technology

Single-Phase Direct Liquid Cooling for Dense Compute

As computing systems become denser, managing heat is a critical challenge. High-power processors and racks generate heat far exceeding air cooling capabilities. Single-phase direct liquid cooling offers a solution by circulating coolant over hot components.

Modern AI accelerators can exceed 1,000 watts, and racks can dissipate over 100 kilowatts, making heat the primary design constraint. Excess heat causes thermal throttling, reducing performance and hardware lifespan.

Air cooling is insufficient for high rack densities. Liquid cooling, however, absorbs and transfers heat much more effectively in a closed loop.

Single-phase direct liquid cooling works by mounting coldplates on high-heat components. Coolant circulates through these coldplates, absorbing heat and returning it to a distribution unit.

This method supports higher chip and rack densities in a smaller footprint due to liquid's superior heat storage and transfer capabilities compared to air.

The white paper compares single-phase direct liquid cooling with two-phase and immersion cooling approaches.

It also examines projected growth in processor power and rack density, and their implications for future thermal design strategies.

AI-samenvatting op basis van de bron.